Sumida Flexible connections

PANTA© SMD

PANTA© SMDCompact SMD connector for high volume

The PANTA© SMD SYSTEM has been designed especially to connect sandwiched PCBs or PCBs positioned at different angles. It offers the user a great variety of possible configurations when designing electronic equipment.

As flexible connecting element for surface connection (Surface Mount Technology, SMT) the SMD-Jumpers are very compact in size and allow the production of smaller and more cost effective electronic devices. Also they can be placed on both sides of the printed circuit boards (PCBs). They are optimized for automatic assembly and high volumes and are supplied in blister package for removal and positioning with nozzles in pick and place process (SMT placement equipment).

An additional advantage of our SMD Flex Jumper is the improved electrical properties, especially at higher frequencies. In addition, the SMD Jumpers can also be used as a cost effective alternative to rigid-flex printed circuit boards. To reach that you just need to combine or connect two conventional PCB’s with a PANTA SMD-Jumper as a connecting element. (Surface Mounted Interconnect, SMI).

Product description

The PANTA© SMD jumper has been designed to connect sandwiched PCBs or PCBs positioned at different angles. It offers the user a great variety of possible configurations when designing electronic devices.

  • Applicable for reflow soldering process
  • Competitive Connection technique as an alternative to rigid-flex or milled pcb-solutions 
  • High temperature capability
  • Placement by SMD assembly machines (automated Pick&Place)
  • Post bending of printed boards possible after panel separation up to 180°

Characteristics

  • Pitch: 0.93 mm
  • Bridge length: 11.2 mm
  • Total length: 15.2 mm
  • Number of pins: 4 - 25 of 0,93 mm pitch
  • Packaging unit: 1500 pcs. on returnable reel
  • Special pitches and other pin counts on request
  • Customized SMD solutions available

Order code

Order Code PANTA© SMD

Technical data

Pitch (mm)0,93
Max. number of pins4 - 25 pol
Insulation materialPolyimide insulation, 25 µm + adhesive
Insulation resistance (S)108
Coplanarity (mm)0,15
Min. bending radius (mm)2,0
Max. bending cycle20 x 135°
Conductor materialCu 150 µm Sn
Current rating at 20°C (A)2* (DIN EN 60512-5-2)
Resistance against soldering heat:IPC/JEDEC J-STD 020 D
Recommended Reflow ProfileDIN EN 61760
Operating temperature (°C)−40°C bis +125°C

PANTA© SMD

PANTA© SMD catalog.pdf (0,9 MB)

You can also get digital PDF of our product catalogues »